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Cytec Formulated Resins

Cytec Formulated Resins

A Cytec desenvolve compostos de poliuretano e epóxi e sistemas de resina de alta tecnologia. Eles fornecem esses produtos para potting e encapsulação, revestimento conformal, adesivo, selante, aplicações de resina para ferramental e elastômero para a defesa, aeroespacial, eletrônica, biomédica, computador e outros mercados.

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  1. Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 1 gal

    Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 1 gal

      

    CONACURE EA-028 provides Limited flexibility, pot life of 30 minutes, low viscosity. Will cure in thin films at room temperature. Very good thermal shock resistance. Saiba mais
  2. Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 5 gal

    Cytec CONACURE EA-028 Epoxy Encapsulant Catalyst 5 gal

      

    CONACURE EA-028 provides Limited flexibility, pot life of 30 minutes, low viscosity. Will cure in thin films at room temperature. Very good thermal shock resistance. Saiba mais
  3. Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 1 gal

    Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 1 gal

      

    CONACURE EA-87 provides Limited flexibility, pot life of 90 minutes, low viscosity, EA-87 requires heat to cure in thin films. Less expensive than EA-028. Saiba mais
  4. Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal

    Cytec CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal

      

    CONACURE EA-87 provides Limited flexibility, pot life of 90 minutes, low viscosity, EA-87 requires heat to cure in thin films. Less expensive than EA-028. Saiba mais
  5. Cytec Conap CE-2290 Acrylic Conformal Coating 1 gallon pail

    Cytec Conap CE-2290 Acrylic Conformal Coating 1 gallon pail

      

    CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The solvent portion of CE-2290 is an EPA (United States Environmental Protection Agency) -approved composition containing no ozone depleting chemicals and it is noncarcinogenic. 1 gallon pail. Saiba mais
  6. Cytec Conap CE-2290 Acrylic Conformal Coating 1 qt

    Cytec Conap CE-2290 Acrylic Conformal Coating 1 qt

      

    CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The solvent portion of CE-2290 is an EPA (United States Environmental Protection Agency) -approved composition containing no ozone depleting chemicals and it is noncarcinogenic. 1 quart. Saiba mais
  7. Cytec Conap CE-2290 Acrylic Conformal Coating 5 gallon pail

    Cytec Conap CE-2290 Acrylic Conformal Coating 5 gallon pail

      

    CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The solvent portion of CE-2290 is an EPA (United States Environmental Protection Agency) -approved composition containing no ozone depleting chemicals and it is noncarcinogenic. 5 gallon pail. Saiba mais
  8. Cytec Conapoxy RN-1000 Epoxy Encapsulant Resin 1 Gal

    Cytec Conapoxy RN-1000 Epoxy Encapsulant Resin 1 Gal

      

    CONAPOXY RN-1000 is a diluted epoxy potting and casting resin. When CONAPOXY RN-1000 is cured with the curatives listed below, these systems possess low shrinkage, low exotherm, good thermal shock and electrical properties. Saiba mais
  9. Cytec CONATHANE EN-21 Polyurethane Encapsulant Part B 1 Gal

    Cytec CONATHANE EN-21 Polyurethane Encapsulant Part B 1 Gal

      

    CONATHANE EN-21 is a two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin system. This system was formulated specifically for the potting, casting, embedding, and encapsulation of electronic circuits, components, and power devices. Saiba mais
  10. Cytec CONATHANE EN-21 Polyurethane Encapsulant Part B 1 Qt

    Cytec CONATHANE EN-21 Polyurethane Encapsulant Part B 1 Qt

      

    CONATHANE EN-21 is a two-component, liquid, low viscosity, low toxicity, room temperature curing polyurethane resin system. This system was formulated specifically for the potting, casting, embedding, and encapsulation of electronic circuits, components, and power devices. Saiba mais

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